JPH0162023U - - Google Patents
Info
- Publication number
- JPH0162023U JPH0162023U JP1987156492U JP15649287U JPH0162023U JP H0162023 U JPH0162023 U JP H0162023U JP 1987156492 U JP1987156492 U JP 1987156492U JP 15649287 U JP15649287 U JP 15649287U JP H0162023 U JPH0162023 U JP H0162023U
- Authority
- JP
- Japan
- Prior art keywords
- die
- sheet
- extrusion molding
- lip
- attaching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001125 extrusion Methods 0.000 claims 2
Landscapes
- Extrusion Moulding Of Plastics Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987156492U JPH0162023U (en]) | 1987-10-13 | 1987-10-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987156492U JPH0162023U (en]) | 1987-10-13 | 1987-10-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0162023U true JPH0162023U (en]) | 1989-04-20 |
Family
ID=31435080
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987156492U Pending JPH0162023U (en]) | 1987-10-13 | 1987-10-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0162023U (en]) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5325351A (en) * | 1976-08-23 | 1978-03-09 | Hitachi Ltd | Heat treatment method of semiconductor wafers |
-
1987
- 1987-10-13 JP JP1987156492U patent/JPH0162023U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5325351A (en) * | 1976-08-23 | 1978-03-09 | Hitachi Ltd | Heat treatment method of semiconductor wafers |